cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 1/7 HBN2412C6 cystek product specification general purpose npn epitaxial planar transistors (dual transistors) HBN2412C6 features ? two btc2412 chips in a sot-563 package. ? mounting possible with sot-523 automatic mounting machines. ? transistor elements are independent, eliminating interference. ? mounting cost and area can be cut in half. ? low cob. typ. cob=2.0pf. ? complementary to hbp1037c6 ? pb-free lead plating and halogen-free package. equivalent circuit outline sot-563 HBN2412C6 tr1 tr2 c1 b2 e2 e1 b1 c2 ordering information device package shipping HBN2412C6-0-t1-g sot-563 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 2/7 HBN2412C6 cystek product specification the following characteristics apply to both tr1 and tr2 absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 60 v collector-emitter voltage v ceo 50 v emitter-base voltage v ebo 6 v collector current i c 200 ma power dissipation pd 150(total) (note) mw junction temperature tj 150 c storage temperature tstg -55~+150 c note : 120mw per element must not be exceeded. characteristics (ta=25c) symbol min. typ. max. unit test conditions bv cbo 60 - - v i c =100 a bv ceo 50 - - v i c =1ma bv ebo 6 - - v i e =50 a i cbo - - 100 na v cb =60v i ebo - - 100 na v eb =5v v ce(sat) - - 0.3 v i c =100ma, i b =10ma v be(sat) - - 1 v i c =100ma, i b =10ma h fe 200 - 560 - v ce =6v, i c =1ma h fe 25 - - - v ce =6v, i c =150ma f t 300 - - mhz v ce =20v, i c =10ma, f=100mhz cob - - 4 pf v cb =5v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2%
cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 3/7 HBN2412C6 cystek product specification typical characteristics output characteristics 0 0.05 0.1 0.15 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=100ua ib=200ua ib=300ua ib=400ua ib=500ua output characteristics 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=0.5ma ib=1ma ib=1.5ma ib=2ma ib=2.5ma output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=2ma ib=4ma ib=6ma ib=8ma ib=10ma output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=0 ib=5ma ib = 10 m a ib=15ma ib=20ma ib=25ma current gain vs collector current 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) current gain--- hfe hfe@vce=6v saturation voltage vs collector current 10 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) saturation voltage---(mv) vce(sat)@ic=10ib
cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 4/7 HBN2412C6 cystek product specification typical characteristics(cont.) saturation voltage vs collector current 100 1000 0.1 1 10 100 1000 collector current --- ic(ma) saturation voltage---(mv) vbe(sat)@ic=10ib cutoff frequency vs collector current 10 100 1000 0.1 1 10 100 collector current --- ic(ma) cutoff frequency---ft(mhz) ft@vce=12v power derating curve 0 20 40 60 80 100 120 140 160 0 50 100 150 200 ambient temperature ---ta( ) power dissipation---pd(mw) single dual capacitance characteristics 1 10 100 0.1 1 10 100 reverse-biased voltage---(v) capacitance---(pf) f=1mhz cib cob
cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 5/7 HBN2412C6 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c202c6 issued date : 2014.05.11 revised date : page no. : 6/7 HBN2412C6 cystek product specification recommended wave soldering condition peak temperature soldering time product pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cyst spec. no. : c202c6 ech electronics corp. issued date : 2014.05.11 revised date : page no. : 7/7 HBN2412C6 cystek product specification sot-563 dimension inches millimeters inches millimeters marking: ma product code date code: year+month year: 6 2006, 7 2007 month: 1 1, 2 2, ??? 9 9, a 10, , c 12 b 11 6-lead sot-563 plastic surface mounted package cystek package code: c6 style: pin 1. emitter1 (e1) pin 2. base1 (b1) pin 3. collector2 (c2) pin 4. emitter2 (e2) pin 5. base2 (b2) pin 6. collector1 ( c1 ) dim min. max. min. max. dim min. max. min. max. a 0.021 0.024 0.525 0.600 b 0.007 0.011 0.170 0.270 a1 0.000 0.002 0.000 0.050 e1 0.043 0.051 1.100 1.300 e 0.018 0.022 0.450 0.550 e 0.059 0.067 1.500 1.700 c 0.004 0.006 0.090 0.160 l 0.004 0.012 0.100 0.300 7 ref 7 ref 0.059 0.067 1.500 1.700 d notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
|
